Wire Bond Process Engineer

A leading semiconductor manufacturer is seeking a Wire Bond Process Engineer to strengthen its assembly engineering team amid ongoing expansion.

Key Responsibilities:

• Optimize wire bond processes to improve quality, yield, and process stability.
• Manage and standardize bond recipes across various package and die types.
• Troubleshoot wire bond issues using structured problem-solving tools (e.g. 8D, DOE).
• Drive continuous improvement from early feasibility through volume ramp-up.
• Implement and maintain process controls to ensure manufacturability and reliability.
• Own the process and lead corrective actions when quality or technical issues arise.

Requirements:

• Bachelor's or Master's in Engineering or related technical field.
• At least 3 years of experience in wire bond process within semiconductor manufacturing.
• Familiarity with package types such as PQFN, SO8FL, SOIC, or TOLL is a plus.
• Strong analytical mindset and experience in structured problem solving.
• Confident communicator with the ability to present technical topics effectively.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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