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Wire Bond Process Development Manager

Job description

Our client is a rapidly expanding semiconductor MNC in Melaka. Due to rapid expansion, they are currently seeking a Wire Bond Process Development Manager.


Key Responsibilities:

  • Lead the development and optimization of wire bonding processes, including process design, equipment selection, and material evaluation.
  • Manage a team of engineers and technicians to ensure successful execution of wire bond process projects.
  • Collaborate with cross-functional teams, including design, quality, and production, to drive process improvements and resolve technical issues.
  • Establish and maintain process documentation, including process flow diagrams, standard operating procedures (SOPs), and control plans.
  • Conduct rigorous process characterization and validation to ensure robust and repeatable wire bonding processes.
  • Implement continuous improvement initiatives to enhance process efficiency, yield, and reliability.
  • Stay current with industry trends, advancements in wire bonding technologies, and emerging best practices.
  • Provide technical support and training to production staff to ensure proper execution of wire bonding processes.
  • Lead root cause analysis and corrective action activities for process-related defects and failures.
  • Oversee the introduction of new wire bonding equipment and technologies into the production environment.
  • Develop and manage project plans, budgets, and timelines to meet company goals and objectives.

Skills & Experience Required:

  • Bachelor's or Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
  • Minimum of 5-7 years of experience in wire bonding process development within the semiconductor industry.
  • Proven track record of successfully developing and optimizing wire bond processes for semiconductor packaging.
  • Strong leadership and team management skills, with the ability to mentor and develop engineering talent.
  • In-depth knowledge of wire bonding equipment, materials, and techniques.
  • Excellent problem-solving skills and the ability to apply structured methodologies for root cause analysis and process improvement.
  • Experience with statistical process control (SPC), design of experiments (DOE), and other process optimization tools.
  • Familiarity with industry standards and quality systems, such as ISO 9001, IATF 16949, or similar.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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