Staff Process Engineer, Front of Line

Our client is a global semiconductor player who is seeking to hire a Staff Process Engineer, specializing in Front of Line (Wire Bond & Die Bond).


Key Responsibilities:

• Develop, optimize, and manage processes related to semiconductor device assembly.
• Collaborate with cross-functional teams including R&D, manufacturing, and quality assurance to drive improvements.
• Ensure compliance with development procedures and standards.
• Conduct experimental planning and statistical analysis to enhance process performance and yield.
• Provide recommendations on materials and processes for product development.
• Work closely with design and materials teams to ensure project success.
• Maintain detailed documentation of process development activities.

Skills & Experience Required:

• Degree in Engineering.
• Experience in semiconductor device assembly processes.
• Knowledge of materials used in semiconductor assembly.
• Familiarity with industry-standard development procedures and statistical analysis techniques.
• Specific process knowledge in areas such as wire & die bonding, soldering, or assembly.
• Experience in module design and material selection.
• Project management experience in semiconductor development.
• Proficiency with data analysis and process optimization software.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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