Principal Package Integrator (Semiconductor)

This multinational semiconductor company in Negeri Sembilan is looking for a Principal Package Integrator to join their team.


Key Responsibilities:

• In line with business strategy, develop and introduce new package solutions
• Responsible to derive technical risk and work closely with the cross-functional teams in order to effectively deliver new package solutions to the development project assigned
• Technical consultant in project base , correspond to design rule review , technical risk assessment and problem solving

Skills & Experience Required:

• Degree (at minimum) in Engineering (Electronics/Material Sciences/relevant)
• > 7 years' experience in Clip bond package and process development
• Experience in SiC , GaN , IGBT product engineering and package design requirement
• Firm comprehensive knowledge pertaining to process and equipment technologies related to semiconductor packaging.
• Technical skill: Package Design Rule Review, Thermal and stress simulation, DFMEA, PFMEA, Systemic New Product Development Approach (DFM, DMADV, DFSS), AutoCAD
• Able to actively build up and broaden own competencies and contacts, share into the organization.
• Keeping up to date with state of the art packaging, material and process developments.
  
  

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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