Senior Wire Bond Process Development Engineer

Our client is a leading global semiconductor manufacturer known for its advanced backend packaging technologies. They are currently hiring a Process Development Engineer (Wire Bond) to drive process innovation and support new product introductions.

Key Responsibilities:

• Develop and optimize wire bond processes for new and existing product lines

• Lead troubleshooting, parameter tuning, and hands-on machine setup for wire bond equipment

• Drive yield and quality improvements using DOE and structured problem-solving

• Ensure process stability and equipment capability within production environments

• Collaborate with R&D, production, and quality teams to implement technical solutions

• Document process control plans, FMEAs, and engineering reports

• Train and guide junior engineers and technicians

Skills & Experience Required:

• Degree in Engineering (Electrical, Mechanical, Materials, Mechatronics, or related field)

• Minimum 5 years of experience in wire bond process development or sustaining

• Strong hands-on experience with wire bond machines and parameter optimization

• Familiar with DOE, FMEA, and root cause analysis techniques

• Excellent communication skills and ability to work in cross-functional teams

• Self-motivated and capable of working independently in a fast-paced environment

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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