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Senior Die Bond Process Development Engineer

Job description

Our client is a leading global semiconductor manufacturer with a strong presence in Malaysia. They are currently looking to hire a Process Development Engineer (Die Bond) to support NPI, process improvements, and equipment optimization within their advanced backend operations.

Key Responsibilities:

  • Lead die attach process development for new products, including parameter optimization and process validation
  • Collaborate with R&D, manufacturing, and equipment teams to ensure robust process integration
  • Drive improvements in yield, quality, and productivity through structured problem solving and DOE
  • Support equipment qualification and setup for new bonding technologies (e.g., soft solder, epoxy, double tape)
  • Participate in NPI builds and drive process readiness for mass production
  • Ensure documentation of process specifications, FMEA, control plans, and work instructions
  • Conduct technical reviews and support continuous improvements based on customer feedback

Skills & Experience Required:

  • Bachelor's Degree in Engineering (Mechanical, Electronics, Materials, or related field)
  • Minimum 5 years of hands-on experience in die attach or die bond processes (solder, epoxy, or tape)
  • Familiarity with wire bond is a plus
  • Strong problem-solving and analytical skills; able to conduct DOE and use SPC tools
  • Experience in semiconductor backend or advanced packaging is preferred
  • Good communication skills and cross-functional collaboration experience

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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