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- Posted 22 November 2024
- SalaryNegotiable
- LocationMalaysia
- Job type Permanent
- DisciplineEngineering
- Reference277370_1732264613
Engineering Manager
Job description
Our client is a rapidly expanding Semiconductor company in Malacca. They are currently seeking an Engineering Manager who will oversee the areas of Die Bond, Plating, Dispensing, Testing.
Key Responsibilities:
- Leadership & Team Management: Lead a team of engineers and technicians, fostering a collaborative environment that promotes innovation, problem-solving, and high performance. Mentor and develop team members to reach their full potential.
- Process Optimization: Manage and enhance die bonding, plating, dispensing, and testing processes to improve production efficiency, yield, and product quality. Implement best practices and drive continuous improvement initiatives.
- Quality Assurance: Collaborate closely with the quality team to ensure all processes meet stringent quality standards and regulatory requirements. Identify and address quality issues proactively to maintain a high standard of product reliability.
- Project Management: Plan, organize, and execute projects aimed at process enhancement, cost reduction, and equipment upgrades. Track project milestones, allocate resources, and ensure timely completion within budget.
- Collaboration: Work cross-functionally with R&D, production, and supply chain teams to support product development, resolve technical challenges, and ensure smooth production workflows.
- Data Analysis: Utilize data-driven approaches to monitor production metrics, analyze trends, and identify opportunities for improvement. Ensure that all equipment and processes operate within defined specifications and parameters.
- Troubleshooting & Problem-Solving: Address technical challenges within the die bonding, plating, dispensing, and testing processes swiftly and effectively, providing technical guidance and hands-on support as needed.
- Compliance & Safety: Ensure compliance with company policies, industry standards, and safety regulations in all engineering activities. Promote a culture of safety within the team and address any potential risks.
Skills & Experience Required:
- Bachelor's or Master's degree in Engineering, Electronics, Material Science, or a related field.
- Minimum of 5-7 years of experience in semiconductor manufacturing, with a focus on die bonding, plating, dispensing, and testing processes.
- Proven experience in a leadership role within a manufacturing or engineering environment, preferably in the semiconductor industry.
- Strong understanding of production processes, equipment, and materials used in die bonding, plating, and dispensing.
- Demonstrated ability to lead and motivate a technical team.
- Excellent analytical and problem-solving skills with a data-driven mindset.
- Strong project management skills with the ability to handle multiple priorities and meet deadlines.
- Proficiency in English; knowledge of other languages used in Malaysia (Mandarin proficiency would be an added benefit).
To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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