Die Bond Equipment Engineer

Our client is a leading semiconductor manufacturer, looking to hire a Die Bond Equipment Engineer to support equipment maintenance, troubleshooting, and performance improvement initiatives within its backend assembly operations.

Key Responsibilities:

• Troubleshoot and maintain die bond equipment to minimize downtime

• Perform preventive and predictive maintenance activities

• Support NPI builds and machine qualifications

• Analyze equipment data and drive corrective actions

• Collaborate on yield and OEE improvement initiatives

• Coordinate with vendors on technical support and upgrades

• Ensure adherence to safety, quality, and EHS standards

• Train technicians on equipment handling and maintenance practices

Skills & Experience Required:

• Degree in Electrical, Mechanical, or Mechatronics Engineering

• 2-5 years of hands-on experience with die bond/die attach machines

• Preferred exposure to ASM, Palomar, Shinkawa, or H&K equipment

• Strong troubleshooting and problem-solving capabilities

• Familiarity with TPM, SPC, or Lean practices is a plus

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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