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This rapidly expanding semiconductor company in Melaka is seeking a Die Bond Equipment Engineer due to expansion.
- Equipment Maintenance: Perform routine and preventive maintenance on die bond equipment to ensure it operates at peak efficiency. Troubleshoot and repair equipment issues promptly to minimize downtime.
- Process Optimization: Collaborate with process engineers to optimize die bond processes for improved yield, throughput, and quality. Implement improvements and enhancements as needed.
- Equipment Operation: Operate die bond equipment during production runs, monitoring and adjusting settings to meet quality and production targets. Ensure the equipment is calibrated and maintained according to industry standards.
- Quality Assurance: Conduct inspections and quality checks on bonded dies to ensure they meet specifications and quality standards. Address any deviations and take corrective actions when necessary.
- Documentation: Maintain accurate records of equipment maintenance, adjustments, and process changes. Create and update standard operating procedures (SOPs) for die bond equipment operation.
- Training: Train and mentor technicians and operators on the safe and effective operation of die bond equipment. Provide guidance on best practices and troubleshooting techniques.
- Safety: Adhere to all safety protocols and guidelines when working with equipment. Promote a culture of safety within the team.
- Continuous Learning: Stay up-to-date with advancements in die bond equipment technology and semiconductor manufacturing processes. Implement best practices and innovative solutions to drive efficiency and quality improvements.
Skills & Experience Required:
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field (or equivalent work experience).
- Proven experience working with die bond equipment in a semiconductor manufacturing environment.
- Strong troubleshooting skills and the ability to diagnose and resolve equipment issues.
- Proficiency in programming and configuring die bond equipment.
- Excellent attention to detail and commitment to quality.
- Effective communication skills and the ability to work collaboratively in a team.
- Knowledge of semiconductor manufacturing processes is a plus.
- Safety-conscious mindset.
To apply, please click "APPLY NOW" or email Shan Li at email@example.com. Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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