Backend Package Development Engineer

Our client is a global semiconductor manufacturer seeking a Senior Manager-level New Product Engineering (NPE) Technical Lead to drive the development of power modules and discrete devices for automotive and industrial applications.

Key Responsibilities:

• Lead product-level engineering decisions and define Product Requirement Documents (PRDs)
  
• Drive cross-functional design teams covering package modeling, simulations, DFMEA, and validation plans
  
• Coordinate schedules, manage risk, and align engineering deliverables with strategic goals
  
• Support business case development through costing, yield, and CAPEX insights
  
• Lead day-to-day engineering execution from design to volume manufacturing release

Skills & Experience Required:

• Master's in Electrical/Electronics Engineering, Physics, or Materials Science
  
• Minimum 12 years in semiconductor NPI, specifically in power modules/discretes
  
• Strong expertise in modeling, simulations, and system-level architecture
  
• Proven leadership across design, test, reliability, and manufacturing functions
  
• Excellent English communication and stakeholder management skills

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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