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Wire Bond Package Development Engineer

Job description

My client is a global semiconductor chip maker. They are looking for a Wire Bond Packaging Engineer due to rapid expansion.

Job Description

  • Develop new package requirements and maintaining quality of existing packages
  • Determine package requirements for customer requirements and product groups.
  • Perform integrity analysis of packages by utilizing the right tools.
  • Develop package reduction programs and perform cost effectiveness studies


  • Hands on experience in process development for wire bond
  • Minimum 5 years of relevant experience
  • Bachelor's degree in mechanical/electrical/electronic engineering or equivalent courses

To apply, please click "APPLY NOW" or email Shane Tong at Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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