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Senior Consultant, Engineering
My client is a global semiconductor chip maker. They are looking for a Wire Bond Packaging Engineer due to rapid expansion.
- Develop new package requirements and maintaining quality of existing packages
- Determine package requirements for customer requirements and product groups.
- Perform integrity analysis of packages by utilizing the right tools.
- Develop package reduction programs and perform cost effectiveness studies
- Hands on experience in process development for wire bond
- Minimum 5 years of relevant experience
- Bachelor's degree in mechanical/electrical/electronic engineering or equivalent courses
To apply, please click "APPLY NOW" or email Shane Tong at firstname.lastname@example.org. Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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