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Wire Bond Package Development Engineer

Job description

My client is a global semiconductor chip maker. They are looking for a Wire Bond Packaging Engineer due to rapid expansion.

Job Description

  • Develop new package requirements and maintaining quality of existing packages
  • Determine package requirements for customer requirements and product groups.
  • Perform integrity analysis of packages by utilizing the right tools.
  • Develop package reduction programs and perform cost effectiveness studies

Requirements

  • Hands on experience in process development for wire bond
  • Minimum 5 years of relevant experience
  • Bachelor's degree in mechanical/electrical/electronic engineering or equivalent courses

To apply, please click "APPLY NOW" or email Shane Tong at shane.tong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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