Wire Bond Development Engineer

Our client is a semiconductor MNC in Central Malaysia. They are seeking to hire a Wire Bond Research & Development Engineer.

Key Responsibilities:

• Aluminium (Al) Wire Bonding Process Development:
• Understand power module design and suggest improvements related to Al wire bonding.
• Expertise in DFMEA, updating DFMEA, and generating PFMEA linked with it.
• Knowledge of Al wire materials and identifying key process variables (KPIV) from failure modes.
• Define KPOV and analyze process capabilities.
• Prepare technical reports on FMEA failure modes using statistical tools like JMP and Minitab.
• Collaborate with technical leaders to generate deliverables like Control Plans and D/PMEAs.
• Technical Leadership in Al Wire Bonding:
• Lead new process and equipment initiatives with technical leaders and suppliers.
• Oversee P.O specification generation and buy-off processes.
• Develop COO for new processes and equipment.
• Benchmark new and improved processes/equipment not currently in use.
• Create a process technology roadmap and define new design rules based on characterization.
• Understand customer requirements and environmental, health, and safety (EHS) standards.
• Provide systematic solutions and improvement plans for process defects.
• Support quality issues in production and collaborate with the manufacturing team.
• COE Line Equipment Maintenance and Management:
• Hands-on experience in setting up Al wire bonding equipment and tooling.
• Design tooling and jigs in collaboration with designers and suppliers.
• Ensure timely equipment/tooling/jig readiness.
• Lead technicians/operators to ensure correct task execution.
• Share technical issues, results, and improvement plans with technical leaders.

Skills & Experience Required:

• Experience: Minimum 10 years, particularly in Al wire bonding (Al wedge, Au/Cu ball bonding), with a background in design or equipment engineering being a plus.
• Package Expertise: Familiar with transfer molded power modules, including Intelligent Power Modules, Dual Side Cooling Modules, and Power Discrete.
• Nationality: Local candidates preferred.
• Education: Bachelor's or Master's degree.
• Skills: Proficient in English, statistical software (JMP, Minitab), Auto-CAD, and MS Office (especially PowerPoint).
• Personal Traits: Self-motivated, independent, communicative, open-minded, and willing to take risks and manage challenges.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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