Wire Bond Development Engineer

Our client, a growing player in the semiconductor space, is seeking a Wire Bond Development Engineer to support next-phase technology initiatives.

Key Responsibilities:

• Drive development and enhancement of wire bonding processes, particularly in aluminum wedge bonding.
• Support new product introduction and continuous improvement projects.
• Collaborate across functions to improve materials, processes, and yield performance.
• Analyze data to identify trends, troubleshoot issues, and ensure process stability.
• Stay updated on emerging technologies and contribute to R&D innovation.

Skills & Experience Required:

• Degree in Engineering, Materials Science, or related fields.
• Solid understanding of semiconductor assembly processes; aluminum wire bonding experience preferred.
• Strong analytical, problem-solving, and cross-functional collaboration skills.
• Exposure to R&D or product development in a manufacturing environment is an advantage.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.my/refer-a-friend