Packaging Engineer (Project Management, SMT)

Our client is a global semiconductor company in Malacca. They are now seeking to hire a Packaging Development Engineer.


Key Responsibilities:

• New Product Integration: Lead the integration of new products into the Power Module platform, collaborating with design, development, and operations teams to ensure smooth execution.
• Stakeholder Collaboration: Act as the primary liaison between internal and external stakeholders, including design engineers, production teams, quality assurance, and supply chain, to ensure alignment on project goals and timelines.
• Project Management: Oversee large-scale projects from initiation to completion, ensuring that all aspects of the project meet technical, quality, and timeline requirements. Provide regular status reports and escalate issues when necessary.
• Cross-functional Coordination: Ensure smooth transition of product designs into the production environment by working closely with manufacturing teams. Manage the coordination of materials, tools, and processes for seamless production rollouts.
• Technical Expertise: Leverage deep technical expertise in packaging technologies, particularly in power modules, to troubleshoot complex engineering challenges, provide innovative solutions, and drive continuous improvement initiatives.
• Production Support: Support the production line by addressing any packaging-related issues, ensuring that all processes comply with internal quality standards, and proposing process optimizations to improve efficiency and yield.
• * Documentation & Reporting: Create and maintain thorough documentation on design specifications, project timelines, and production reports. Provide upper management with timely and accurate project updates.

Skills & Experience Required:

• Experience: 5-13 years of experience in packaging engineering, ideally with exposure to power module platforms.
• Technical Knowledge: Deep understanding of packaging technologies, with hands-on experience in the design, development, and production of power modules. Experience with product packaging for semiconductors and electronic components is essential.
• Project Management: Proven ability to manage large projects, including the development of project plans, schedules, and resource management. PMP certification or similar project management credentials would be an advantage.
• Stakeholder Management: Strong interpersonal and communication skills, with the ability to interact effectively with a wide range of stakeholders, both internally and externally.
• Problem-Solving Skills: Excellent analytical and troubleshooting skills with a proven ability to resolve complex engineering challenges and optimize production processes.
• Experience with FOL/EOL processes is highly desirable.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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