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Our client is a world-leading chip manufacturer from the U.S. Due to increasing demand from their customers worldwide, they are looking to add a Packaging Development Engineer to join their team.
- Develop new package requirements and maintaining quality of existing packages for all product groups.
- Define package requirements for product groups and customer requirements.
- Develop new package and process qualification programs.
- Perform integrity analysis of packages utilizing appropriate tools.
- Perform package characterizations including cost effectiveness studies.
- Perform hands on development activities on metrology tools and packaging equipment.
- Act as a liaison with vendors as a subject matter expert.
- Maintain product quality while developing and introducing package cost reduction programs.
- Coordinate the introduction of new package processes into production.
- Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
- Bachelor's degree in Mechanical or Electrical Engineering.
- Demonstrated strong analytical and problem solving skills.
- Strong verbal and written communication skills.
- Ability to work in teams and collaborate effectively with people in different functions.
- Strong time management skills that enable on-time project delivery.
- Demonstrated ability to build strong, influential relationships.
- Ability to work effectively in a fast-paced and rapidly changing environment.
- Ability to take the initiative and drive for results.
- Hands on experience in process development for Wirebond, or EOL processes will be advantageous.
To apply, please click "APPLY NOW" or email Shan Li at email@example.com. Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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