FOL Process Engineer

Our client is a Semiconductor Multinational company in Melaka. They are looking for an Front-of-Line Process Engineer.

Key Responsibilities:

• Develop and improve die attach or wire bond processes using DOE and quality tools.
• Monitor and resolve process issues to enhance yield, reliability, and compliance.
• Maintain documentation and ensure adherence to industry standards.
• Collaborate cross-functionally to support production and resolve technical issues.
• Lead continuous improvement efforts and stay current with semiconductor trends.

Skills & Experience Required:

• Degree in Electrical, Mechanical, or Materials Engineering
• Hands-on experience in semiconductor assembly (die attach or wire bond)
• Proficient in SPC, FMEA, and statistical/process control tools
• Basic CAD knowledge is a plus
• Strong problem-solving, communication, and teamwork skills
• Trilingual: English, Malay, and Mandarin

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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