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This leading semiconductor company in Melaka is seeking a Die Bond Process Engineer due to rapid expansion.
- Responsible for Die Bond process engineering segment from manufacturing.
- Handle yield improvement, quality improvement, disposition on-hold material and etc.
- Active team participation on new package / platform / technology development from design to production release.
- Perform package integrity analysis using appropriate tools.
- Engage in new material assessment and development.
- Collaborate with equipment supplier on design, tooling upgrade, process development and software improvement for new process introduction.
- Maintain product quality while developing and introducing package cost reduction programs.
- Timely develop and introduce new products with competitive cost/ differentiation
- To optimize and perform proof of principles independently on existing/newly developed platform/product
- Characterize, evaluate and define Packaging Design Rule and New Package Specification.
- Coaching to junior engineer and technician on process and equipment.
Skills & Experience Required:
- Bachelor / Master Degree in Engineering (Electronics, Electrical, Mechanical) or Physics.
- Minimum 5 years relevant experience in related field.
- Experience in semiconductor package design, advance packaging experience, and Assembly process control is preferred.
- Knowledge in die bond, solder print, reflow, Xray / CSAM inspection, power module assembly is preferred.
To apply, please click "APPLY NOW" or email Shan Li at firstname.lastname@example.org. Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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