Die Bond Equipment Engineer

This rapidly expanding semiconductor company in Melaka is seeking a Die Bond Equipment Engineer due to expansion.

Key Responsibilities:

• Equipment Maintenance: Perform routine and preventive maintenance on die bond equipment to ensure it operates at peak efficiency. Troubleshoot and repair equipment issues promptly to minimize downtime.
• Process Optimization: Collaborate with process engineers to optimize die bond processes for improved yield, throughput, and quality. Implement improvements and enhancements as needed.
• Equipment Operation: Operate die bond equipment during production runs, monitoring and adjusting settings to meet quality and production targets. Ensure the equipment is calibrated and maintained according to industry standards.
• Quality Assurance: Conduct inspections and quality checks on bonded dies to ensure they meet specifications and quality standards. Address any deviations and take corrective actions when necessary.
• Documentation: Maintain accurate records of equipment maintenance, adjustments, and process changes. Create and update standard operating procedures (SOPs) for die bond equipment operation.
• Training: Train and mentor technicians and operators on the safe and effective operation of die bond equipment. Provide guidance on best practices and troubleshooting techniques.
• Safety: Adhere to all safety protocols and guidelines when working with equipment. Promote a culture of safety within the team.
• Continuous Learning: Stay up-to-date with advancements in die bond equipment technology and semiconductor manufacturing processes. Implement best practices and innovative solutions to drive efficiency and quality improvements.

Skills & Experience Required:

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field (or equivalent work experience).
• Proven experience working with die bond equipment in a semiconductor manufacturing environment.
• Strong troubleshooting skills and the ability to diagnose and resolve equipment issues.
• Proficiency in programming and configuring die bond equipment.
• Excellent attention to detail and commitment to quality.
• Effective communication skills and the ability to work collaboratively in a team.
• Knowledge of semiconductor manufacturing processes is a plus.
• Safety-conscious mindset.

To apply, please click "APPLY NOW" or email Liam Malik at liam.malik@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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