Assembly Package Development Manager

This global semiconductor company in Northern Malaysai is seeking an Assembly Package Development Manager.

Key Responsibilities:

• Lead development of advanced semiconductor packaging solutions
• Drive innovation, quality, and cost improvements in packaging design and materials
• Collaborate with internal teams and customers on customized packaging needs
• Manage projects, timelines, and cross-functional teams
• Ensure compliance with industry standards and maintain thorough documentation
• Mentor team and promote a culture of innovation and excellence

Skills & Experience Required:

• Degree in Materials Science, Mechanical, Electrical Engineering, or related field
• 8-15 years in semiconductor packaging, with hands-on development experience
• Skilled in wire bonding, flip chip, BGA, QFN, WLCSP (a plus)
• Proven track record in end-to-end packaging projects and design enhancements
• Strong in problem-solving, leadership, and cross-functional collaboration
• Global experience, materials science, and reliability testing knowledge are advantages
• Open to expatriates; visa sponsorship available

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.my/refer-a-friend