Assembly Package Development Manager

This global semiconductor company in Perak is seeking an Assembly Package Development Manager.


Key Responsibilities:

• Lead the design, development, and qualification of new semiconductor packaging solutions, ensuring they meet both industry standards and customerspecific requirements.
• Drive continuous improvement in packaging technology, materials, and processes to enhance performance, reliability, and manufacturability.
• Work closely with internal teams (product engineering, operations, quality) and external customers to develop cutting-edge packaging solutions that align with market demands.
• Collaborate directly with customers to understand their packaging needs and deliver customized solutions.
• Enhance and further develop customer-provided packaging designs to ensure they meet performance specifications and manufacturing requirements.
• Serve as the technical point of contact for customers during the package development lifecycle, addressing any concerns or adjustments as needed.
• Manage and execute packaging development projects, ensuring timely delivery, budget adherence, and high-quality results.
• Coordinate cross-functional teams, including process engineers, material scientists, and quality assurance, to achieve project milestones.
• Develop project plans, timelines, and deliverables, ensuring alignment with customer and organizational goals.
• Stay updated on the latest semiconductor packaging technologies, trends, and market requirements.
• Introduce innovative packaging technologies and materials to the organization, enhancing product performance and reducing costs.
• Implement continuous improvement processes within the packaging team, focusing on quality, yield improvement, and cost optimization.
• Lead, mentor, and develop a team of engineers and technicians within the packaging department.
• Foster a collaborative and high-performance work culture, encouraging innovation and knowledge sharing.
• Ensure all packaging designs, materials, and processes comply with industry standards, regulatory requirements, and customer specifications.
• Maintain thorough documentation of packaging development processes, specifications, and test results.

Skills & Experience Required:

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• 8 to 15 years of experience in semiconductor packaging, with a strong background in package development, integration, and optimization.
• Proven experience developing packaging solutions from scratch, as well as enhancing customer-provided designs.
• Strong knowledge of semiconductor packaging technologies, including wire bonding, flip chip, BGA, QFN, and WLCSP would be advantageous.
• Experience managing end-to-end development projects, from concept to production.
• Excellent problem-solving, analytical, and leadership skills.
• Strong communication and interpersonal skills, with the ability to engage with cross-functional teams and customers.
• Experience working in a global semiconductor packaging environment.
• Familiarity with materials science and failure analysis related to packaging would be an added benefit.
• Understanding of reliability testing and quality control for packaging solutions would be a plus.
• Visa sponsorship is available for this position - expatriates ae welcome to apply.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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