Assembly Package Development Engineer

This global semiconductor company in Perak is seeking an Assembly Package Development Engineer.


Key Responsibilities:

• Design, develop, and qualify new semiconductor packaging solutions that meet both internal and customer specifications.
• Innovate and refine packaging technologies, focusing on improving performance, reliability, and manufacturability.
• Work on the full lifecycle of packaging projects, from concept design through to qualification and mass production.
• Engage directly with customers to understand their packaging requirements and provide tailored packaging solutions.
• Further develop and enhance packaging designs provided by customers to
• optimize for performance and manufacturability.
• Serve as a key technical liaison between Carsem's engineering teams and customers throughout the packaging development process.
• Investigate new materials, processes, and technologies to advance semiconductor packaging capabilities.
• Continuously improve existing packaging designs to optimize yield, reliability, and cost-effectiveness.
• Stay abreast of the latest trends and advancements in semiconductor packaging and introduce new technologies where applicable.
• Lead and manage packaging development projects, ensuring adherence to project timelines and budgets.
• Work cross-functionally with process engineering, product development, quality, and operations teams to ensure seamless execution of projects.
• Prepare detailed technical reports, documentation, and presentations on packaging development and project status

Skills & Experience Required:

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• 8 to 15 years of experience in semiconductor packaging, with strong expertise in package development and integration.
• Experience with various semiconductor packaging technologies, including wire bonding, flip chip, BGA, QFN, WLCSP, etc would be a bonus.
• Ability to develop new packaging solutions from scratch and enhance customersupplied designs.
• Strong problem-solving skills and ability to work with cross-functional teams.
• Excellent communication skills, with the ability to effectively collaborate with

• customers and internal stakeholders.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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