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Die Bond Process Engineer

Job description

This company in Malacca is a global semiconductor manufacturer with operations across the region. Due to rapid expansion, they are looking to add a Die Bond Engineer to their team.

Key Responsibilities:

  • Responsible for Die Bond process engineering segment from manufacturing.
  • Handle yield improvement, quality improvement, disposition on-hold material and etc.
  • Active team participation on new package / platform / technology development from design to production release.
  • Perform package integrity analysis using appropriate tools.
  • Engage in new material assessment and development.
  • Collaborate with equipment supplier on design, tooling upgrade, process development and software improvement for new process introduction.
  • Maintain product quality while developing and introducing package cost reduction programs.
  • Timely develop and introduce new products with competitive cost/ differentiation
  • To optimize and perform proof of principles independently on existing/newly developed platform/product
  • Characterize, evaluate and define Packaging Design Rule and New Package Specification.
  • Coaching to junior engineer and technician on process and equipment.

Skills & Experience Required:

  • Bachelor / Master Degree in Engineering (Electronics, Electrical, Mechanical) or Physics.
  • Minimum 5 years relevant experience in related field.
  • Experience in semiconductor package design, advance packaging experience, and Assembly process control is preferred.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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